Elements to be considered in PCB Material Selection

The material, usually a substrate as far as PCB is concerned, plays a key role in PCB as it carries its leading functions and characteristics. In addition, PCBs allow PCBs to comply with some of the high and specific requirements specified by the products or projects for which they will work. Moreover, it is useful to reduce the cost and improve the reliability of products when choosing the optimal material.

Elements to be Considered in PCB Material Selection

• Glass Transition Temperature (Tg)

Tg refers to the temperature at which materials are converted into a glass case. The standard Tg remains above 130 ℃ while the Tg is above 170 ℃ and the middle Tg is above 150 150.

When it comes to PCB design services materials, a higher Tg should be selected, which should be higher than the current operating temperature.

• Coefficient of Thermal Expansion (CTE)

As the material warms, the material will suffer from expansion or contraction. When it comes to PCB manufacturing, since CTEs in X, Y and thickness are different, the PCB will become deformed. Moreover, the painted aperture may suffer breakage or damage the components. Therefore, CTE of the substrate material must be low enough.

• Heat Resistance

PCB is required to be heat resistant. In general, PCBs should have a heat resistance of 250 ℃ / 50s, which also works on materials.

• Flatness

PCB is required for excellent flatness feature. As far as SMT assembly is concerned, the PCB is required to feature a war sheet less than 0.0075 mm / mm.

• Electrical Performance

HF circuits require PCB materials with low static and constant dielectric loss. Besides, the insulation resistance, insulation strength and arc resistance must be in compliance with the requirements of the product.

Correlation between PCB Material Selection and Product or Industry

The choice of PCBs plays a crucial role in contributing to product reliability and is also determined by industry specificity and requirements.

Electronic products requiring higher environmental temperature or flexibility requirements, a substrate made of polyimide glass fiber is applied. For high frequency, PTFE fiberglass substrate should be applied. For PCBs that call for a higher heat dissipation requirement, the basic metal substrate must be used.

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